Electronics Forum | Mon Sep 24 20:33:34 EDT 2001 | davef
Assuming you're seeing this during wave solder, the via acts like a heat pipe conducting 450�F [or whatever] air to your solder balls. Check the fine SMTnet Archives for similar threads and perspective on the direction to take.
Electronics Forum | Mon Nov 12 06:05:15 EST 2001 | nop_e
Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.
Electronics Forum | Mon Nov 19 05:49:44 EST 2001 | Cheng
The BGA solder ball composition is 62/36/2 Sn/Pb/Ag, does any problem exist for the solder joint reliability? And what is the difference on SMTA process between this and the normal 63/37 ball?
Electronics Forum | Wed Dec 05 11:56:43 EST 2001 | russells
Please help!! Operators are currently using soldering irons set at approx 450 degrees C, this i realise is far to high, but can some one tell me the effect on the PCB and joint at this temp and the recommended temp for soldering.
Electronics Forum | Tue Dec 11 15:04:42 EST 2001 | davef
Sure those products and other competitors listed in the fine SMTnet Archives provide a uniform solder deposit, how do you suggest that Russ provide the proper amount of flux and heat to properly form his solder connection?
Electronics Forum | Wed Jan 16 07:03:46 EST 2002 | mattcorroboy
I am trying to find out some stats on the soldering of fine pitch devices. e.g. What are the chances of a short or open when a device is soldered using good techniques to a board. i.e. 1 in a 1000, 1 in a 1000000..?
Electronics Forum | Wed Jan 30 06:45:01 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Jan 31 04:48:04 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Feb 28 20:37:17 EST 2002 | davef
What kind of "auditor" is this? Who does this auditor work for HP or CR Technologies? Maybe the auditor can quote 'chapter & verse' of the IPC specifications that state: * Inspection of any type is required to assure solder print processing repeata
Electronics Forum | Fri Apr 19 23:08:14 EDT 2002 | francis khoo
Hello Pete, Thank you very much for your detailed information. Personally, I like shorter solder lands as it would provide a localised solder joint instead of spreading the solder on "unused" location. You have been very helpful. Much appreicated. T
