Electronics Forum: use (Page 1278 of 2487)

Integration of manual odd form / low volume pick and place

Electronics Forum | Tue Aug 20 07:35:04 EDT 2002 | bmulcahy

Hi, I guess you a looking for a manual x-y table with a vacuum pick up such as SMT6000 from OK industries. I presume these are still being made-- We use one successfully at the end of a Mydata machine to place low volume components which we cannot j

Integration of manual odd form / low volume pick and place

Electronics Forum | Fri Aug 23 22:22:01 EDT 2002 | caldon

We have a great sophistcated Manual/Semi Assembly station available for BGS, QFP, Chips, CSP......Can use matrix trays, tape reel,Cut tape reel, loose parts, and sticks. Please contact me off line for more details. I am not a salesman....AppsEng.

Integration of manual odd form / low volume pick and place

Electronics Forum | Wed Aug 28 10:51:27 EDT 2002 | edmentzer

We use a manual "pick and place" unit similar to the OK product, and it work great. The parts are in a tray and the operator moves the pick up head over the part and press down which turns on the vacuum, the vacuum is turned off when the part is pla

Non-contact jet-fluxing

Electronics Forum | Tue Aug 20 22:37:15 EDT 2002 | dwoon

I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control. How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting thi

50 PPM

Electronics Forum | Wed Sep 04 14:14:55 EDT 2002 | melo_guy

I like that "Lies, dam lies and statistics." thats a riot, only because its SO TRUE. Ill remember that i'm sure ill be able to use it sometime. My company does a lot of those graphs and charts that all relate to things that make no sense. I'm in c

OSP and SIR

Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend

We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib

Repair of FR4 double-sided pcb

Electronics Forum | Thu Aug 22 07:48:30 EDT 2002 | Dave Milk

While separating individual pcbs from a panel, operators have caused delamination of the edge of the board, at the tabs that were cut. How can these boards be repaired? The delamination causes them to fail J-STD-001C 9.2.1.1.d. Also, what would yo

Aqueous cleaner water disposal

Electronics Forum | Tue Aug 27 08:13:29 EDT 2002 | mk

Our company uses a conveyorised aqueous cleaner to wash printed circuits after water soluble solder paste is reflowed. The system is closed loop with carbon and resin filters. The water eventually will get dirty. Can it be dumped? Treated? How do y

Poor Fuji recognition of PhyComp 0603 (1608) cap

Electronics Forum | Fri Sep 20 05:17:10 EDT 2002 | byates

What are the error codes?? you dont even know if it is the vision type until you have checked this out. It could be camera lighting. Do you know how to use vision trace on your machine? What is your x&y tolerance? What about vision 254 or 255 have yo

component shelf life

Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont


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