Electronics Forum: base (Page 130 of 313)

solder fillet peeling

Electronics Forum | Thu Jul 03 13:10:39 EDT 2003 | slthomas

I snapped a board in half at a cracked solder joint, and the component pulled free of the solder and still has a very thin layer of metal on the termination end. Based on the construction spec.(solder over nickel over palladium), it looks like it

Repairing balls on BGA's

Electronics Forum | Mon Jul 07 09:32:28 EDT 2003 | caldon

There are companies that provide technologies to do this: Manncorp has a unit - http://www.manncorp.com/p-m-7500rb.htm and Winslow Automation - http://www.winslowautomation.com and http://www.ape.com/reball_kits.html and companies providing thi

Feeder/Machine Maintenance Tracking

Electronics Forum | Fri Sep 05 13:00:40 EDT 2003 | cabjerk

Hi: How simple or complex do you want? We run PFS software, but for our Feeder Maint we used access and just wrote a simple pgm and tied it into our PFS. What PFS gives us is how often the feeder is change out and this is used to base a feeder PM

Screen Printing for BGA

Electronics Forum | Fri Aug 22 10:20:26 EDT 2003 | Stephen

I hate being persnickity, I just am sometimes. You are not being told you "should expect" that variance. You are being told you can't sue them for manufacturing defects if the balls are within that range. That range is way bigger than what they wil

Screen Printing for BGA

Electronics Forum | Fri Aug 22 15:49:40 EDT 2003 | paulm

Thanks Steve for your rather colorful and sarcastic input. If I correlate your asteroid assessment with what our QA Departments data(that tells us we are experiencing this problem about 5% of the time and I am guessing higher when we are forced or re

BGA Bowing on the corners.

Electronics Forum | Tue Aug 26 08:59:27 EDT 2003 | fmonette

For more information on moisture-induced BGA warpage, I suggest you read the following paper that was recently presented at ECTC : "Impact of Ingressed Moisture and High Temperature Warpage Behavior on the Robust Assembly Capability for Large Body

Shelf life of electro-plated tin-lead on stainless steel

Electronics Forum | Sat Nov 08 10:04:26 EST 2003 | severs

Once you have selected your plating based on electrical and physical requirments, you should know that there is an inexpensive plastic storage packaging developed by Lucent which can keep any platings solderability from degrading for up to 10 years o

CONCOAT

Electronics Forum | Thu Nov 13 11:49:50 EST 2003 | pbarton

Adam, Not had any experience of the stuff myself but a quick Google reveals that KF1280 is 'Vernis de Protection' (French for Protection Varnish), available in aerosol cans. try this link: http://www.gotronic.fr/catalog/circuits/aerosol2.htm Unless

Solder defect problem.

Electronics Forum | Mon Dec 01 15:21:08 EST 2003 | davef

Hey, I thought you were in the BIG house on some trumped-up tax rap. We use many RF shields each month. Generally, the shields are not plated and made of alloy 770 (or alloy 752), half hard temper, as the base material. * Alloy 770; 55%Cu, 27%Zn,

Vapour Degreasing

Electronics Forum | Wed Dec 03 03:11:09 EST 2003 | ADAM

tHANKS FOR THE RESPONSE GUYS. I'll be checking out those websites during the day Cal. With regards to youR response Daniel. All our soldering materials are Alphametal products and are RMA based. As much as we would like to use ultrasonics on all our


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