Technical Library | 2007-07-19 15:15:11.0
ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries.
Technical Library | 2008-08-28 22:50:11.0
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.
Technical Library | 2009-03-25 17:14:11.0
This article presents design guidelines for helping users of HDMI mux-repeaters to maximize the device's full performance through careful printed circuit board (PCB) design. We'll explain important concepts of some main aspects of high-speed PCB design with recommendations. This discussion will cover layer stack, differential traces, controlled impedance transmission lines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors.
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2020-11-15 21:22:11.0
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with reference to nickel corrosion. The interpretation of the existing specification, that judges corrosion on 3 levels, is complex and if misinterpreted can lead to phantom failures. An obvious way to avoid any potential misinterpretation is to eradicate any evidence of corrosion completely.
Technical Library | 2021-12-16 01:33:11.0
Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.
Technical Library | 2007-03-13 14:31:11.0
Do you have an idea for an electronic product, the next must-have gadget, music or video system, time saver, or the greatest problem-solving device that was ever invented? Before you begin designing the product, there are a number of tasks that you must complete and issues that you must resolve before you have an actual product design that can be produced, marketed, and sold. This article will provide you with some guidelines to assist you in getting your idea turned into a successful design. Other issues, such as whether or not to apply for a patent for your product idea and in detail how a particular product should be advertised or marketed will not be addressed in this article.
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
Technical Library | 2013-08-08 15:23:11.0
In this project Machine Vision PCB Inspection System is applied at the first step of manufacturing, i.e., the making of bare PCB. We first compare a PCB standard image with a PCB image, using a simple subtraction algorithm that can highlight the main problem-regions. We have also seen the effect of noise in a PCB image that at what level this method is suitable to detect the faulty image. Our focus is to detect defects on printed circuit boards & to see the effect of noise. Typical defects that can be detected are over etchings (opens), under-etchings (shorts), holes etc...
Technical Library | 2013-08-15 13:12:11.0
An automated visual PCB inspection is an approach used to counter difficulties occurred in human’s manual inspection that can eliminates subjective aspects and then provides fast, quantitative, and dimensional assessments. In this study, referential approach has been implemented on template and defective PCB images to detect numerous defects on bare PCBs before etching process, since etching usually contributes most destructive defects found on PCBs. The PCB inspection system is then improved by incorporating a geometrical image registration, minimum thresholding technique and median filtering in order to solve alignment and uneven illumination problem. Finally, defect classification operation is employed in order to identify the source for six types of defects namely, missing hole, pin hole, underetch, short-circuit, mousebite, and open-circuit.
