Electronics Forum: 1991 (Page 2 of 5)

Re: Poor solderability

Electronics Forum | Fri Feb 11 05:44:08 EST 2000 | Dean

Sounds like black pad to me. I just suffered this last week. Track your fab lot codes. Just in case. I processed 1000 fabs of 2 lot codes through 1 line (also WS609). 1 lot code failed with black pad the other did not. With one common mfg. proc

CAM/ALOT Dispensers

Electronics Forum | Tue Mar 31 14:41:12 EST 1998 | Arlie Keith

For Sale, two CAM/ALOT 1824 glue dispensers. These machines are in decent shape, but need the interface boards and the pump if they're to be used for SMT glue. They are the same as a Model 1818 now that they have been refurbished. One was refurb

12 Year Old Components?

Electronics Forum | Fri Sep 13 09:02:52 EDT 2002 | tvielhaber

A distributor has some smt components (QFP) packaged in a vacuum sealed package with a 1991 date code. Should I accept these parts? What are the main issues I need to be concerned about? Solerability, moisture? Won't the vaccum seal package minim

Solder Balls

Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef

Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava

BGA rework clearance

Electronics Forum | Fri Apr 26 05:50:54 EDT 2019 | ppcbs

We just apply tacky flux to the surrounding components and to the bottom side components under the BGA. This will prevent cold solder if any solder joints reach reflow temperature the surface tension will keep them aligned and in place. If you nee

Solid Solder Deposit

Electronics Forum | Mon Apr 23 09:18:15 EDT 2001 | Brandon

We are currently investigating getting a small SMT line in-house...very low quantities. I have been looking at Screen Printers and have also stumbled across Solid Solder Deposit Technology at 2 companies. I'm not sure whether we want to have the So

Operative system for Reflow RF10A-M and PRU of SP10P-M

Electronics Forum | Mon Sep 22 16:48:39 EDT 2003 | samaniegocesar

I will apreciate your support to get the Operative system for reflow oven RF10A-M and PRU system for Screen Printer SP10P-M both machines are 1991, my disc are damaged and the reflow Oven and printer can not read, maybe some of you have this kind of

i have to buy one NXT from Fuji What do you think???

Electronics Forum | Fri Dec 17 04:03:41 EST 2004 | Rob

Hi Vinit, Not entirely sure of the exact dates, but I think you may be being a little creative in your comparisions. The CP4 was definitely around by 1991, whereas I'm sure the base 1 FCM appeared around 1996. A fairer comparison would be the CP6

Substrate Au/Ni thickness

Electronics Forum | Mon Feb 19 18:57:49 EST 2001 | davef

Expanding on the limit of the portion of gold acceptable in a solder connection [mentioned in an earlier post]: The embrittlement culprit, AuSn4, is 29 weight percent gold. So even if one had 100% tin as the solder alloy and 10% gold were dissolved

Question on Nitrogen Consumption during Reflow

Electronics Forum | Tue Jun 26 19:50:00 EDT 2001 | davef

49 hits on nitrogen, you probably used the one with the entry window => 13 or whatever hits on nitrogen. Here is my take on what you missed by using the other seach: Date: May 26, 2001 04:57 AM Author: Brian Sloth Bentzen Subject: Nitrogen Reflow


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