Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (
Panasonic NPM Modular SMT Chip Mounter Machine Product name Panasonic NPM SMT Chip Mounter Model NPM-D3 NPM-W2 NPM-TT2 NPM-W2S Concept Dual-gantry, multi-head, process-driven module Dual-gantry,
Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
SMT peripheral equipment mainly refers to: printing press, docking station, Mounter, reflow soldering, AOI, wave soldering and other equipment. SMT peripheral technology is similar to the original hyper threading technology. Users who have experienc
Fast Smart Modular Mounter RS-1R standard 150mm conveyor extensions, 250mm conveyor extensions, upstream and downstream upstream and downstream Board siz
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Refurbished NXT-III 2xM3III (2 x H24S Head) FUJI SMT Pick and Place Machine Specification of FUJI AIMEX III SMT SMD Pick and Place Machine MC Model M3 III M6 III Applicable PCB size (LxW) 48 x 48 mm to 250 x 510 mm (dou
Various Assembleon AX Nozzles. V- series, L-series, CPL and SL Featured Assembleon Parts: Assembleon AX Vision placement Tools Assembleon AX Laser Heads AX 301 Compact Placement robot ITF Feeder Prep A series and many more
Panasonic NPM-D3A Modular Pick And Place Machine Panasonic NPM-D3A Modular Pick And Place Machine The NPM-D3 is an industry standard building block in high-speed, high volume applications ranging from automotive to industrial to medical. In fact, t
Hanwha SM481 Plus SMT Pick And Place Machine Feature The SM481PLUS can perform high-speed placement of chips at 40,000CPH and QFPs at one per 1.1 seconds, respectively (each at optimum speed) by applying the on-the-fly recognition technology patente
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
