Electronics Forum | Wed Feb 14 02:38:13 EST 2007 | Wayne
The middle of the BGA has to make sure it has 235 deg C (if you are using SAC paste), otherwise it will not form good joint.
Electronics Forum | Fri May 17 22:25:51 EDT 2002 | xzinxzin
*the other components are 0402 and SOIC 16, the solderability were good. *the protection on the terminations of microleadframe package is Cu(copper),somebody call that leadless leadframe package(LLP). *the time above 210 deg C is about 10 sec. *I us
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
