Electronics Forum | Thu Mar 05 10:47:15 EST 2009 | SS
Certain packages will always be out 90 degrees or so when a program is first ran on mydata. Is there a way to automatically adjust rotations for mydata packages when generated with circuitcam? Is there a location where we can adjust the angles circui
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Electronics Forum | Wed Oct 28 17:30:55 EST 1998 | Chrys
| | Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | | | That information should be contained in the technical data sheets suppli
Electronics Forum | Mon Aug 27 19:24:00 EDT 2001 | sharafali
It has been mentioned that DPMO offers large advantages over First Pass yield calculations for measuring process performance!!regarding the same I have a few queries: What are the benchmarks for using DPMO as measures of process performance? How is
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Thu Apr 30 14:41:46 EDT 2009 | bandjwet
There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts. In t
Electronics Forum | Wed Feb 15 17:16:54 EST 2012 | davef
To get started look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=61862 On your lingering disbelief of your suppliers truthfulness in the C of C: Periodic auditing of their truthfulness by your QA peeps or a third party is an acce
Electronics Forum | Tue Jun 01 10:11:00 EDT 2004 | davef
Intermetallic growth is a diffusion process, the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the activation energy and R (8.314 J mo
Electronics Forum | Wed Jul 22 00:43:05 EDT 1998 | P.L. Sorenson - Technical Consultant
| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? My personal experience using PEM for military avionics applications has been very positive. H
Electronics Forum | Wed Jul 22 15:48:35 EDT 1998 | David Pinsky
| | Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? | My personal experience using PEM for military avionics | applications has been very positi
