Industry News | 2014-08-06 11:35:43.0
Speedline Technologies' Electrovert division will host a free PCB cleaning and reliability workshop in Guadalajara, Mexico, together with Kester and Zestron. The entire workshop will be presented in the Spanish language.
Industry News | 2016-08-17 19:15:40.0
Horizon Sales is pleased to announce the MI SMTA Meeting and Member Appreciation Golf Outing. The outing is scheduled to take place Monday, September 12, 2016 at the Oak Pointe Country Club in Brighton, MI.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2014-09-06 15:42:26.0
PARMI announces the Jet Solder Jet Dispenser Unit for its award-winning SIGMA X SPI Series. Jet repairs solder paste deposits within the machine to eliminate expensive rework and scrap, maximizes throughput and increases ROI.
Industry News | 2015-02-24 17:11:27.0
PARMI announces that it has been awarded a 2015 NPI Award in the category of Test & Inspection – SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was presented during a Tuesday, Feb. 24, 2015 ceremony at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2010-08-17 14:51:15.0
Enjoying the materials innovation success it has realized with its first DEK Galaxy system, Cary, North Carolina-based LORD Corporation recently expanded its development capacity with the addition of a second Galaxy equipped with DEK’s new Wafer Transport Solution.
Industry News | 2012-07-24 07:03:23.0
With Alternative Tracks, the SIPLACE team has made the setup process in electronics manufacturing even more flexible.
Industry News | 2013-10-08 16:27:28.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
