Technical Library | 2011-07-07 03:37:13.0
The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components
Technical Library | 2022-05-02 21:35:53.0
Testing of electronic assemblies involves three elements: the device under test, test equipment, and fixturing to make the connections between them. The challenge for a test engineer building a sophisticated test system is that instrumentation may need to measure thousands of test points through the mechanical interconnect.
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2023-05-07 19:26:34.0
Misprint Circuit Assemblies ■ Cleaning misprints is a production gap ■ Commonly cleaned in stencil cleaning equipment ■ Stencil Cleaning equipment allows for the + Collection and filtration of wet solder paste ■ Stencil Cleaning equipment short comings + Inability to clean B-Side misprints + Poor rinse quality 3
Technical Library | 1999-08-09 11:09:42.0
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements.
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
Technical Library | 2023-06-12 16:52:47.0
The technological advancement of component and PCB technology from through-hole to surface mount (SMT) is a major factor in the miniaturization of today's electronics. Smaller and smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. With advancement, however, comes a new set of challenges in building these smaller, more complex assemblies. This is the challenge original equipment manufacturers (OEM) and contract manufacturers (CM) face today.
Technical Library | 2009-09-18 14:52:06.0
Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on populated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs.
Technical Library | 2023-11-14 19:52:11.0
The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.
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