Electronics Forum | Thu Jan 29 18:01:20 EST 2004 | davef
Rethinking to Ramp / Soak: Yano, staying with ramp might not be all that bad after all, just decrease the ramp / slow-down the conveyor.
Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny
I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Electronics Forum | Wed Feb 05 15:16:15 EST 2003 | davef
If the voiding is not related to entrapped air in your vias, consider trying a different paste.
Electronics Forum | Fri Feb 07 11:58:47 EST 2003 | dphilbrick
We went to Indium WS to help reduce this type of issuse as well might want to think about a cross through the middle this has also helped us on similar issues.
Electronics Forum | Tue Jul 30 21:44:13 EDT 2002 | sohct
Hi Anyone has experience in manufacturing RF PCB and encounter voids on the grounding pads? The grounding pad is covered by the a big component. Question is does voids in the solder joint affect the RF operation?
