Electronics Forum | Tue Feb 06 21:21:37 EST 2001 | davef
I know dip about your question. Try: Sri Venkat, Advanced Packaging & Interconnects, Coherent Photonics Group Laser Division, Santa Clara, 408-764-4446 sri_venkat@cohr.com
Electronics Forum | Wed Aug 23 08:50:04 EDT 2000 | Dave F
Dr. Lee: We had a discussion on the forum recently and I wanted to get your input. What is the best method(s) for elimating (reducing) no-clean solder paste flux from splattering on gold interconnect fingers on a PCA?
Electronics Forum | Wed Jul 18 20:58:54 EDT 2001 | Charles A. Harper
Two more recent books are Electronic Packagind and Interconnection Handbook,Third Edition,2000; and High Performance Printed Circuit Boards,2000.I served as Editor for both.Charlie Harper PS to Dave Fish-Please contact me regarding two new books usef
Electronics Forum | Thu Jul 09 07:44:48 EDT 1998 | Jim Zanolli
Teka Interconnection Systems offers connectors with solder and flux deposited on each lead allowing for reflow without adding solder paste. www.tekais.com 401-785-4110 fax: 401-781-5730
Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Fri Apr 15 16:14:49 EDT 2005 | davef
Jim Zanolli of Teka Interconnect did an "OnBoard Forum" a couple of years ago [ http://www.smtnet.com/forums/index.cfm?CFApp=2&forum_idx=44 ]. He certainly would be a good point of contact.
Electronics Forum | Tue Dec 13 15:51:11 EST 2005 | Amol Kane
what part was this? was the high temp solder on the first level interconnect? why is the high lead solder being soldered with a SAC alloy?
Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz
Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz
Electronics Forum | Thu Dec 17 03:20:32 EST 2009 | tod1967
Sounds like a good challenge. What is your interconnect bond method? Solder Paste, Pre-Form/Liquid Flux or Paste, Assuming your using solder. Reflow method?
