Industry News | 2012-07-26 09:54:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference
Industry News | 2014-04-18 21:23:36.0
Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.
Industry News | 2021-03-30 11:44:23.0
Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Industry News | 2008-04-07 20:17:14.0
ITASCA, IL � February 29, 2008 � Kester announces it will showcase EnviroMark 923 (EM923), a halogen-free, RoHS Compliant lead-free no-clean solder paste, in booth 2C04 at the upcoming NEPCON China/EMT China 2008 exhibition and conference -scheduled to take place April 8-11, 2008 in Shanghai, PR China.
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Wed Dec 11 07:58:38 EST 2019 | clockwatcher
Although this is not technically a bottom termination component, the method of attachment of the thermal pad is a bottom termination attachment. For bottom termination components IPC states that "thermal pad void criteria shall be established between
Electronics Forum | Sun Nov 10 15:36:06 EST 2013 | davef
Assuming your conformal coating material was selected with the intent of living a life in contact with oil, why doesn't your coating meet the IPC-A-610D requirement of that there be no voiding, no breaks in the surface, no loss of adhesion, etc? Furt
