Industry Directory | Manufacturer
Leading EMS company in Denmark, operating in two modern assembly plants, one in Jutland and one close to Copenhagen. One plant is dedicated highly automated volume production and the other plant is a High Mix / Low Volume site. We have a high competence in SMT technology, and operates in 3 shifts with 6 complete SMD lines, AOI, X-ray, Flying Probe, MDA and ICT test systems.
New Equipment | Fabrication Services
Vast Teflon PTFE PCB Processing expirience from leading Low to High DK Materials from Rogers, Taconic, Isola, Shenghyi, and many more. ACI has over 25 years of expirience processing various exotic material substrates and has learned how different com
FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
Industry Directory | Manufacturer
Development and manufacturing of X-ray based inspection systems.
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
New Equipment | Coating Equipment
Plasma treatment prior to conformal coating addresses these detrimental manufacturing issues: Removes organic contaminants Eliminates flux and mold release residue Enhances surface wettability Enhances lead coverage Improves adhesion Systems
Technical Library | 2019-02-20 16:35:24.0
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.
TI New and Original LM3480IM3X-5.0/NOPB in Stock IC SOT23 , 21+ package LM3480IM3X-5.0/NOPB 100mA, 30V Low Dropout RegulatorToday's Hot Deals： TDA8922CTH/N1 HSOP24 NXP 20+ SAK-TC1796-256F150E BE BGA INFINEON20+ KSZ8863FLL LQFP48 MICROCHIP
TI New and Original TIOL112DRCR in Stock IC QFN , 22+ package TIOL112DRCR IO-Link device transceiver with low residual voltage and integrated surge protection TDA8922CTH/N1 HSOP24 NXP 20+ SAK-TC1796-256F150E BE BGA INFINEON20+ KSZ8863FLL L
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