Technical Library | 2009-09-16 15:13:58.0
The dispensing industry within electronics manufacturing represents a very diverse marketplace indeed; many different materials can be applied in many different ways. One high-growth area in this market is underfill, driven by the explosive demand for hand-held devices (HHDs). This segment is comprised of popular consumer goods, such as cell phones, mp3 players, GPS navigators, PDAs, portable games and ultra-mobile PCs. A new, non-contact dispense technology, known as Streaming, has recently been introduced to specifically address the incumbent needs associated with underfill.
Technical Library | 2011-09-02 18:01:36.0
Too often the manufacturers will implement technology for financial reporting purposes but overlook efficiencies that can generate cash flow and reduce costs on the manufacturing floor. Accurate information that provides a business owner or manager the ability to make immediate decisions about his/her operation resulting in a boost to profitability is crucial during an economic downturn. If revenue is down and the market mood does not permit price increases, then profitability can only be realized by reducing costs. So you must ask yourself "What prevents me from 100% efficiency?"
Technical Library | 2023-11-03 18:01:35.0
This case study explores the changing climate for manufacturing in Mexico as volumes and demand increase in the region and manufacturers, including IMI, look to grow through greater automation and closer collaboration with key technology partners like Koh Young. With interviews with Oscar Valdivia, IMI's Manufacturing Unit Manager for Guadalajara, and Philip Reyes, their Regional Engineering Head, the case study digs into how manufacturing excellence can be developed with the right use of automation and by investing in equipment that creates efficiency and quality through better use of accurate data.
Technical Library | 2016-11-10 08:56:54.0
It goes without saying that every manufacturer wants to ensure they are producing a quality product. Standards and specifications from various organizations provide a guideline from which manufacturers can measure different areas of quality, while also providing the end user with the reassurance that they are purchasing a trustworthy, long-lasting product. Within the wire processing industry there are many standards that manufacturers may choose or be required to adhere to. These standards and specifications are constantly evolving and increasing in detail, especially as monitoring technology improves.
Technical Library | 1999-07-20 09:28:38.0
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment...
Technical Library | 2008-05-14 15:44:58.0
This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system.
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Technical Library | 1999-08-09 11:36:27.0
Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs.
Technical Library | 2015-11-12 19:04:51.0
In order to provide the functionality in today’s electronics, printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces, this means no nodules, no pits, and excellent ductility with thinner deposits. One of the areas that has to change to get to this plateau of technology is acid copper plating. Acid copper systems have changed in minor increments since their introduction decades ago. However, the basic cell design using soluble anodes in slabs or baskets has for the most part remained the same. Soluble, phosphorized, copper anodes introduce particulate and limits the ability to control plating distribution.
Technical Library | 2017-09-25 10:36:52.0
Laser wire stripping was developed by NASA in the 1970s as part of the Space Shuttle program. The technology made it possible to use smaller sized wires with thinner insulations, without risk of the damage that can be caused by traditional mechanical wire stripping methods. Laser wire stripping technology was commercialized in the 1990s and was initially used for aerospace and defense applications. Laser wire stripping then grew significantly when the consumer electronics market exploded as lasers became the only stripping solution for the tiny data cables found in laptops, mobile phones and other consumer electronics products. Another large industry that has adopted laser wire stripping methods, and for good reason, is high-end medical device manufacturing.
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