| https://www.eptac.com/soldertip/soldertip-44-ipc-guidelines-for-flux-selection-and-use/
. This will guide you as to whether or not you need to have a cleaning process to remove these residues from the surfaces of your product
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-44-ipc-guidelines-for-flux-selection-and-use
. This will guide you as to whether or not you need to have a cleaning process to remove these residues from the surfaces of your product
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. PCB must be thoroughly cleaned of production residues as well as dirt to ensure reliable further processing and trouble-free performance
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/cleanliness-test_topic1738_post7101.html
PCBA Cleanliness test process? For Ionic Residues on PCBA, there are three methods of testing in IPC-TM-650: Dynamic Extraction Methods, Static Extraction Methods and manual method
| http://www.szhonreal.com/productview.asp?id=20
. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-automatic-solder-nozzle-tinning-system-ensures-consistent-quality
surface of the solder nozzle. While these methods clean the solder nozzle by removing residues, they do not necessarily perform a re-tinning of the solder nozzle which is critical to improving the flow characteristics of the molten solder
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. I would suggest a strong OAH1 FLUX, for tinning the components, with an appropriate cleaning afterwards to remove any of the ionic residues from the surfaces of the leads and components
| http://www.szhonreal.com/productview.asp?id=57
. Use special stirring system to melt the tin residues in the tin container and separate tin and ash in the separation container by the high speed of screw rotation. 1. Characteristic: 1
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
>> News Circuit Board Voids & PCB Delamination Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/amtech-nws-4400-ha-tf-water-washable-lead-free-tacky-solder-flux-rem1
: As a rule of thumb removing M1/H1 flux residues is paramount, however it is an easy task – use warm de-ionized water at 40-60°C with recommended water pressure of 30-50 PSI – NWS
