Electronics Forum | Mon Jun 15 20:30:39 EDT 1998 | Nancy J Dawdy
Would anybody like to share experiences with adding and using the SECS/GEM interface on a multi-vendor line(DEK,FUJI,PANASONIC, UNIVERSAL,BTU)???
Electronics Forum | Tue Dec 11 02:44:26 EST 2001 | ianchan
SMT Experts, Hi, I have a pondering issue, which is : Our current specified Reflow preheat timing is a necessary 100~140sec for the ranges of 100~170Deg-C....obtained timing is 77sec... out of curiousity, if we further fine tune the obtained reflo
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Electronics Forum | Sun Apr 28 18:16:00 EDT 2002 | Dreamsniper
Hi Hany_Khoga, We're using that Glue and here is the profile we are using: 150'C @ 90 secs. 120'C @ 120 secs u can choose between the two, they r both okay and produce good results. regards and enjoy ur day! Dreamy
Electronics Forum | Wed Apr 16 20:22:13 EDT 2003 | praveen
Hi, I have taken the profile.The peak temp. at the lead terminal is 219 degc, duration above MP 54 sec and duration 125 deg C-160 deg C is 60 sec.
Electronics Forum | Tue Mar 31 22:10:43 EDT 2009 | davef
5min) PASS IST Testing (500 cycles) PASS Core Level Hi-Pot Testing PASS (100V/sec; 500Vmax) Finished Circuit Level Hi-Pot PASS (100V/sec; 500Vmax)
Electronics Forum | Thu Jun 05 14:20:55 EDT 2014 | isd_jwendell
230C for max 30 sec.". Isn't 225C close enough to 230C, so that you are effectively exceeding mfg spec by 60 sec.?
Electronics Forum | Wed Mar 06 12:14:34 EST 2002 | caldon
We would benchmark our times with the most experienced operator and them boost the time by 1/3. Example: If it takes Mary 3sec to insert the component, 3 secs to clinch and cut the leads (it is not advised to cut the leads after soldering), and 8 sec
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
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