Electronics Forum | Mon Aug 06 12:30:51 EDT 2001 | Brad R.
I am having some SMT assemblies undergoing thermal shock testing per MIL-STD-883, Method 1011, Test Condition B. I was wondering if anyone has a chart, equation, article, etc. that will give me an idea of the service life of the assembly after it su
Electronics Forum | Thu May 07 08:11:58 EDT 2009 | davef
We don't have a good answer for you, but we do have several thoughts on the issue: * First, tin in your solder or solderability protection is going to diffuse into the copper trace or pad on the board naturally. You can stop that by using a protectiv
Electronics Forum | Mon Mar 31 11:10:43 EST 2003 | davef
First, most �thermal shock� recipes are not a reliability test. There is no relationship between the failures seem in these tests and in-use application. These tests show you the failures in these tests. That�s it!!! Second, accelerated life test
Electronics Forum | Sat Aug 21 08:00:50 EDT 2004 | davef
First, we know of no conformal coating that will help your situation. Second, as you say, companies recognize that stress testing of shippable products is NOT good practice, because it strips life from the product. So, your product is more expensiv
Electronics Forum | Mon May 10 13:55:22 EDT 1999 | Deon Nungaray
| Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | I do not think there is a "typical" post reflow cooling rate out ther
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Mon Jun 26 20:34:14 EDT 2000 | Dave F
Gary: Allow expand on this topic a bit. Back in the gray skied past when people wore calculators on their belts, rather than pagers n Palms, and didn�t drink California spill, they used HASS that you mentioned and HALT (Highly Accelerated Life Test
Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon
| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat
Electronics Forum | Mon Jan 15 14:25:54 EST 2001 | davef
Let me make several points on this issue � POINT 1: Let�s be basic � Soldering and welding are examples of process that the quality types call "special processes". Special process. The results of special processes cannot be verified fully by subs
Electronics Forum | Mon May 10 15:49:52 EDT 1999 | Steve Gregory
| | Can anyone tell me what the recommended "typical" cooling rates are after reflow? Are the cooling rates considered as critical to control as the heating rates and why/why not? | | I do not think there is a "typical" post reflow cooling rate out
