Electronics Forum | Tue Aug 22 10:22:59 EDT 2000 | Wolfgang Busko
Mark: The fact that these daughter boards have to be attached to the TSOP-footprints is what makes the thing difficult cause they will be greater than the original part. One could think that a LCC-design allows for proper routing. But when it comes t
Electronics Forum | Tue Aug 07 01:16:27 EDT 2001 | mugen
When I was reading the smartsonic fantasy, I ended hospitalized for infectious laughs, and side split'in stitches..... Now that cold reality has eased my pain, I must with calm headed purpose, mark my agreement to the Mr.Sean, that salespersons can
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Thu Feb 24 21:44:27 EST 2000 | Dave F
Horace: Area you in the rainy or the dry portion of the South? ;-) Now, excuse me from mincing words with you ;-) �, but buying a manufacturing software package is a serious (expensive) endeavor that will leave no part of your company unscathed. I�d
Electronics Forum | Thu Feb 24 21:44:27 EST 2000 | Dave F
Horace: Area you in the rainy or the dry portion of the South? ;-) Now, excuse me from mincing words with you ;-) �, but buying a manufacturing software package is a serious (expensive) endeavor that will leave no part of your company unscathed. I�d
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC
When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
