Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Thu May 01 09:26:53 EDT 2008 | scottp
Voiding was also the issue I had. I could reduce them substantially by pre-baking the boards, but that's obviously not desirable. Hopefully the chemists have come up with a solution. I extruded some pretty cool looking solder shorts through the vo
Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau
Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering
Electronics Forum | Thu Jul 08 12:33:52 EDT 1999 | Mike Demos
Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. I wi
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Mon Apr 07 04:33:43 EDT 2003 | Neil
Iman, How long after washing the boards do you process them? Are there any vias or Micro vias on any of the pads you see the blow holes on? A possible cause of a blow hole in a solder fillet or PCB is the escaping of Moisture under extreme temps. Th
Electronics Forum | Fri Dec 22 11:32:56 EST 2006 | realchunks
We generaly reduce 25% and get great heat sink capability. Mind you that we do not perferate the pad with vias as recommended. Our toe ends are not plated, so getting any toe fillet is impossible.
Electronics Forum | Tue Jan 25 13:15:17 EST 2000 | Michael Allen
Thanks for the input Mike (and others). As you guessed, via-in-pad is not my idea, and I'm resisting it as much as I can. One of our designers used this practice at some other company, says there were no problems, and wants to use it (via-in-pad) a
Electronics Forum | Thu Mar 29 08:46:23 EDT 2007 | realchunks
Well I DO KNOW! Hi aj, 100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After re
