Electronics Forum | Wed Apr 21 21:50:28 EDT 2004 | adam
Hi I recently having problems on the components having non wetting on the flex circuits. The profile that I am using is according to the solder paste suppiler recommended. Can anyone pls. advise? Regards
Electronics Forum | Thu Dec 01 16:14:45 EST 2005 | chunks
You need to verify if you're getting up to the needed temps. It looks like you're not. I'd say it started to reflow but never reached a long enough time. Nitrogen may help with further wetting.
Electronics Forum | Thu Dec 01 17:24:37 EST 2005 | slthomas
Are you sure you're getting enough paste on the pads? It looks like you may not have enough flux to get the solder to wet properly.
Electronics Forum | Tue May 23 09:27:37 EDT 2006 | Steve
Sorry I misled you. The PCB pads are wetting, but there is no fillet being formed. After reflow, it looks as though no paste was put down on the pads; however the paste print is fine. All other components solder real nice, it's only the Pd-Ag parts t
Electronics Forum | Thu May 25 09:14:04 EDT 2006 | cobar
Print a number of pads of the 0603 on to a ceramic substrate. Then place the 0603 on the paste on the ceramic and refow. If the paste shows no wetting onto the component it will prove that there is a problem with the components solderability.
Electronics Forum | Wed Sep 15 20:59:23 EDT 2010 | genesan
hi All, Here i snap shot previous PCB(HASL) and current PCB(Immersion Silver).Base on the photo it could be PCB oxidize cause the non wetting?
Electronics Forum | Fri Apr 17 22:30:19 EDT 2020 | smith88
IPC calls out 100% wetting to land. I need to understand why this is needed and what functionality I will lose if I have joints at 80%
Electronics Forum | Sun Apr 19 11:19:52 EDT 2020 | davef
A-610G 7.5.16 Components with Bottom Thermal Plane Terminations (D-Pak) says: 100% wetting to land in the end-joint contact area. Is that what you're asking about? Regards, David Fish [davef] Technical Editor & Customer Advocate
Electronics Forum | Mon Jul 29 16:43:55 EDT 2002 | mcm4me
I have a customer with up to 8% scrap from one board supplier and 1% from another supplier for solder dewett and no wet over ENIG finish with mask defined pads. Initially I suspected mask residue on pads because of the no wets but I have come to find
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
