Electronics Forum: wetting standard (Page 2 of 15)

PIHR Inspection Criteria

Electronics Forum | Thu May 17 22:41:05 EDT 2001 | davef

Hi Bob Still getting the cushy jobs, eh? [Tennent's and McEwans are two of my favorites. "Ahh, Beer! My one weakness...my Achilles Heel, if you will..." Homer J Simpson Quote 89/114] Under "Acceptable" for "Pin-In-Hole/Intrusive Reflow Inspection

Re: Poor Solder on TSOP

Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl

| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi

Re: Poor Solder on TSOP

Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel

| | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt

Re: Poor Solder on TSOP

Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin

| | | | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E

Re: Poor Solder on TSOP

Electronics Forum | Thu Jun 25 20:16:01 EDT 1998 | chiakl

| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi

Material Ageing and Storage

Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL

SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul

I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to

100% solder coverage

Electronics Forum | Wed Sep 12 22:57:02 EDT 2007 | lito_visaya

Anyone, We are an electronic assembly contractor and one of our customer requires a 100% solder coverage on pads for their products. We are using flex pcb and we mount only one component (LED for backlight application). The solder paste we are u

Insufficient Wetting to Lands

Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin

We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo

Oxidation on termination of smd chip capacitor

Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray

I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W


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