Electronics Forum: after (Page 14 of 696)

Bad wetting after reflow

Electronics Forum | Fri Apr 09 15:00:04 EDT 2010 | davef

So for your SMT1/SMT2/PTH boards, you have poor solderability during SMT2. [Even if you have no SMT2 and only ST1/PTH, our answer is the same.] We assume this occurs on one board part number only. We guess that your bare boards have insufficient gol

warped boarf after reflowing

Electronics Forum | Mon Sep 17 09:47:18 EDT 2012 | mbnetto

Hi, Do you want to replace the SB ou just reflow it again? Do you suspect there is some "colder solder joint" in one of the SB balls ? In my opinion you are heating the board a lot... Did you put some thermocouple on the ball to check the temperat

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 06:46:27 EDT 2022 | winston_one

What about warpage before reflow? Often the boards with unbalanced copper can be warped initially, and you can reject it... If it's not possible to change the copper, then may be (at least for future lots) it's possible to switch to laminate with hi

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 15:23:48 EDT 2022 | proceng1

I'm sorry to say, but it sounds like your bosses need a reality check. You are having a problem with the product, and it's due to bad design. Yet you can't fix the design, and can't add any time to the process to attempt to make it better. There i

PCB Baking after Wash

Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55

Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D

tombstoning after wave?

Electronics Forum | Fri Dec 08 11:08:03 EST 2000 | Antonio

Ok fellas, tell me how you'd fix this! I'm having melf connectors that are tombstoning in the wave, NOT the reflow, the wave. I've never seen this before. All other parameters are the same...solder, preheats, placements, the board, building humidi

Re: tombstoning after wave?

Electronics Forum | Mon Dec 11 03:46:14 EST 2000 | JohnW

I have to say I've never heard of anything tombstoning over wave, I've seen issues where the glue dot is too high or off to one side creating a poorly seated component that has too big a gap between pad and endcap(and hence an open), but never a tomb

Re: tombstoning after wave?

Electronics Forum | Tue Dec 12 08:53:40 EST 2000 | Wolfgang Busko

I�m with ya both. I�m wondering why the hell those buggers didn�t just drop and started a new career mingling with the dross in the pot. If only a few for statistical reason and to confuse us all just showed this strange behavior and the majority de

pad skipping after HASL

Electronics Forum | Sun Oct 01 23:58:55 EDT 2000 | stuartfd

Dear forum types, 1st timer so be good. I have a customer in China using Coates soldermask that in its self is not a problem. The problem is the flux their using, I think,it appears to have a vary high viscosity. The problem they have laid at my door

Re: solderballs after wavesoldering

Electronics Forum | Tue Aug 22 19:47:57 EDT 2000 | Dave F

No you're NOT, Jax, you�re 100% correctamuno!!! Thanks for setting-up the soap box. I believe that responding to repeated questions other than referring the person to the archives degrades the Forum. This Forum is pathetic in its pandering to peop


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