Electronics Forum | Thu Apr 17 17:57:13 EDT 2014 | proy
Hello We use a 5 zone conceptronics HVN70 and never before have we had something we could not do including 6 layers Rohs complicated boards. Recently we had a larger - simple 2 layer board - all 1206's etc however there are 15 pcs of a LARGE high m
Electronics Forum | Wed Apr 23 09:38:05 EDT 2014 | rgduval
Get in touch with your paste manufacturer. They should have a data base of different oven types/zones, and can give you "baseline" settings for a medium thermal density board that has been proven to work well with their paste. After that, it sounds
Electronics Forum | Tue Feb 19 10:47:47 EST 2019 | rgduval
I'm with Steve. Check the datasheet, and make sure that the terminations are meant for solder application, and not conductive epoxy. I had that happen a year or so ago with an MLCC. Drove us nuts for two days (not to mention the significant rework
Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F
William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Tue Jul 23 07:47:10 EDT 2002 | John S
We have a RAD5 and RAD 8, both of which have the Expanded Range Verifier. Has anyone had success verifying the correct value of electrolytic caps? Our machine stops several times a day for a false failure, and Universal isn't much help. Thanks John
Electronics Forum | Tue Oct 22 14:25:11 EDT 2002 | slthomas
Yeah, but can they place through-hole? We looked at Panasert's Radial a couple years ago. Some big advantages over the Radial Lead 5's that we had at the time, but couldn't deal efficiently with all of our electrolytic cap orientations. We wanted to
Electronics Forum | Thu May 22 18:47:12 EDT 2003 | russ
I would assume we are talking about a radial leaded electrolytic cap? We use Electronic grade RTV (Dow corning 3145). It sticks good and can be removed if necessary. It is also pliable so you don't have to worry about CTE or other stresses that may
Electronics Forum | Mon Oct 13 10:30:49 EDT 2003 | markhoch
PCB is 12.25" x 4". There are large MOSFETS on the board. Two large Electrolytic Caps. Two Large Multi-Layer Ceramic Caps. 15 C Size Tantalym Caps. A fair number of IC's, (SO-8's, SO-16's). No BGA's or finepitch of any kind. The board is double sided
Electronics Forum | Thu Jun 24 11:54:36 EDT 2004 | rickw
many solder-ball issues can be resolved by reducing the aperture size, usually 10 to 15% reduction will work. If the aperture size is the same as the pad size paste tends to be squished out under the part, paste off pad under the part will liquify a
