Electronics Forum: paste volume (Page 14 of 88)

High-speed solder paste dispensing. MY500, MY600, FX-D....?

Electronics Forum | Tue Dec 30 20:14:30 EST 2014 | jeff701

We've actually bought a second FX-D, which is intended to mainly handle smaller, higher-volume boards. That will still serve to improve throughput. But at the same time, we're also adding another pick'n'place machine which has a rated speed that's 2

How Solder paste Volume/Area is calculated for my product.

Electronics Forum | Sat May 29 06:07:16 EDT 2021 | rsatmech

Thanks, I do observed more solder paste terms of percentage in 0.06mm stencil than in 0.08mm stencil.

How Solder paste Volume/Area is calculated for my product.

Electronics Forum | Fri May 21 15:57:08 EDT 2021 | emeto

The thinner the stencil the bigger the variation in terms of percentage. Most probably it was experimentally established, rather than calculated.

type 3 vs type 4 paste

Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc

IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l

Leadfree component plating on Sn/Pb paste

Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef

Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-

SAC solder balls reflow with Sn/Pb paste - Voids Issue

Electronics Forum | Wed Oct 04 16:14:17 EDT 2006 | inds

what is your peak temp.. if you try to go too high say 225-230 deg C there is a fair chance of seeing voids.. depending on your ball size and paste volume you can get a good collapse at temps below 225deg C...

How Solder paste Volume/Area is calculated for my product.

Electronics Forum | Thu May 20 15:58:36 EDT 2021 | rsatmech

My product has 2.4Mil and 3.1Mil stencil. For both the stencil my SPI specification is set as 30% to 160% How this is calculated. Can anyone enlight me. Solder Paste type 5. Minimum opening is 0.16*0.18mm in stencil.

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 05:17:16 EDT 2004 | Alistair MacAdam

I am currently looking at the volume of paste being deposited on a PWB 2.4mm thick with a 0.25mm tolerance. I am looking for information on PWB variation and a MPM AP25 series printer, and can the volume of paste be controlled on varing PWB thickness

Best solder paste printer with solder paste inspection and AOI function-Recomendation

Electronics Forum | Tue May 24 07:51:43 EDT 2022 | spoiltforchoice

Doesn't exist. True Solder Paste dispensing is a Mycronic only solution with Essemtec coming behind with slightly less cpapbility. With Essemtec you can have one machine that prints and places, that saves space, with Panansonic you can have machines

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 10:15:29 EDT 2004 | davef

We agree with John about his comments on the controlable factors relating to your printer, but we'd add that paste formulation and mesh are also contributors to nice looking bricks.


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