Electronics Forum: soldering problem (Page 14 of 507)

problem in solderability

Electronics Forum | Wed Aug 27 15:05:16 EDT 2008 | omid_juve

nothing relates to ROHS components and tin lead process?

problem in solderability

Electronics Forum | Thu Aug 28 14:22:24 EDT 2008 | vladig

That is why you need to do analysis of the failed components first!!! Regards, Vlad www.sentec.ca

problem in solderability

Electronics Forum | Thu Aug 28 14:42:30 EDT 2008 | grics

Vlad, Where might one do this analysis???

problem in solderability

Electronics Forum | Fri Aug 29 14:51:19 EDT 2008 | wavemasterlarry

Vlad; you should pay for advertising like everyone else on this site.

problem in solderability

Electronics Forum | Tue Sep 09 14:58:04 EDT 2008 | vladig

Hey Greg, Do you still want to see the answer? :-) Vlad

problem in solderability

Electronics Forum | Wed Sep 10 04:23:42 EDT 2008 | gregoryyork

Wheres the Gold layer on the non wetted part of the pad

problem in solderability

Electronics Forum | Wed Sep 10 09:43:49 EDT 2008 | gregoryyork

If its Ni/Au and there is no wetting then it should be there you have everything else shown.

problem in solderability

Electronics Forum | Wed Sep 10 14:25:09 EDT 2008 | gregoryyork

VERY TRUE, well said Cheers Greg

problem in solderability

Electronics Forum | Wed Sep 10 17:16:57 EDT 2008 | gregoryyork

does that mean your buying me half a pizza then Vlad

problem in solderability

Electronics Forum | Wed Sep 10 14:39:30 EDT 2008 | vladig

No, we didn't do the test you mentioned, but did EDS on the joints and didn't see carbon their (which would indicate the presence of any organic-based contaminant). For the customer the issue was closed and passed to the board shop. We did work with


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