Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin
Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you
Electronics Forum | Wed Aug 27 21:04:05 EDT 2003 | Dave
Rich, I use water soluble in a DEK Proflow unit. We can print faster (about 4 times faster), and the paste lasts much longer than it being exposed to air. In addition to this, the prints we have now are even better than with a squeegee. I havn't
Electronics Forum | Tue Sep 09 09:25:29 EDT 2003 | james
What about making the customer drawing or parts > list with their rev as a part number on your > parts list? Example: (455556 rev X) would be a > part number on your parts list. What about keeping their revision as A, B, C and in your system it
Electronics Forum | Wed Sep 17 12:30:09 EDT 2003 | russ
I can guarantee that vibrating ovens will be detrimental in double sided reflow for any of the larger parts. I find it interesting about BTU and there "vibrating" oven. I had a couple of these in the early days and they did indeed vibrate. However
Electronics Forum | Tue Dec 23 06:00:36 EST 2003 | Grant Petty
Hi, I am now looking at a DEK as an option, and might raise our budget for this to about $150K. I am not sure which model to look at. We want to do 0201 reliably, and so we need accuracy, but we would also like to get vision inspection so we can let
Electronics Forum | Tue Jan 27 20:03:11 EST 2004 | davef
Consider contacting other university SMT laboratories. Among them are: * Purdue University * Georgia Tech * SUNY Binghamton Actually, you really don't care what the machines do. You care about, 'Which companies will donate machines' [even if they'
Electronics Forum | Mon Feb 02 08:51:52 EST 2004 | emeto
Hello all! That;s not practical one. Can you please tell me where I could find information about PGA uBGA and CSP? I need some historical information what is the technology and topology of the packages, different types Packages. For CSP and FC I a
Electronics Forum | Thu Feb 19 18:07:57 EST 2004 | davef
We're inclined to buy Russ's stuff about peel from the wave. Look here, but shield your eyes first: [ http://www.thepdfshop.co.uk/ppm/defects/Wave/asp/50.asp ] [A respectful bow to BW for the pix] Could you tell us more about: * Board direction thro
Electronics Forum | Thu Mar 04 20:26:11 EST 2004 | davef
Alloying lead does not affect its vapor temperature. As you and others mentioned, the vapor temperature is well out of the range of your processing temperatures. Some people concern themselves about potential health hazards of lead by thinking abou
Electronics Forum | Wed Mar 10 04:52:11 EST 2004 | Gabriele
Hi As I know PBGA reballing is not recommended or better not allowed by all the most important Standards. Exceptionally Cstly Ceramic BGA or Ceramic ColumnGA where you can perform electrical test before reballing (90/10 ball/column-balls made) some
.gif)
