Electronics Forum | Tue Jan 30 10:19:20 EST 2001 | ibi
I think that tolerance of pcb thickness is described in the �1-2-4 of IPC41-01 (Specification for Base Materials for Rigid and Multilayer Printed Boards Supercedes IPC-L-108, L-109, L-112, L-115, AM-361). Good reading,
Electronics Forum | Sat Feb 10 18:33:52 EST 2001 | arturoflores
check the archives (keyword="16 mil pitch") and also consider 45 degree pattern printing. Regards.
Electronics Forum | Mon Feb 19 18:40:43 EST 2001 | davef
Please take us through the options for processing the "waste" liquid that is loaded with solder, adhesives, and what not as a result of cleaning stencils and mis-printed boards. What are the costs for equipment, material disposal, and other items of
Electronics Forum | Thu Mar 15 07:49:44 EST 2001 | jax
I am not sure if it is feasible in your situation becuase I don't know enough about your board ( mixed technology, single-sided, etc.... ) , but have you ever considered screen printing paste onto the test points?? JAX
Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman
We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.
Electronics Forum | Fri Mar 16 16:33:45 EST 2001 | davef
That's what we do also. It's the "print, dispense" sequence that's peculiar, but that's what you need to do if you are going to eliminate the glue cure cycle.
Electronics Forum | Tue Mar 27 15:53:13 EST 2001 | johnw
RW, I've been printing glue by stencil for a while. Like the other guy's say there are various method's and material's that you can use but then your printing paste so the ideal is for as little change as possible to the method's your already using.
Electronics Forum | Tue Mar 27 15:53:14 EST 2001 | johnw
RW, I've been printing glue by stencil for a while. Like the other guy's say there are various method's and material's that you can use but then your printing paste so the ideal is for as little change as possible to the method's your already using.
Electronics Forum | Mon Apr 02 09:42:35 EDT 2001 | davef
Check "Chapter 5: Punching Grade Of Copper Laminates" by RJ Konsowitz in "Printed Circuits Materials Handbook" edited by MW Jawitz
Electronics Forum | Mon Apr 02 11:20:59 EDT 2001 | Gregory Stanton
Anyone know of a good information source on how to manipulate CAM350 Gerber files to create printing stencils? Looking for a "cliff-notes" version of how to operate in CAM350 environment. Thanks
