Electronics Forum | Thu May 05 09:17:58 EDT 2005 | jimmiem
I tried soldering to several of the black pads and was successful, the solder stuck with no hesitation. so i guess this is not truly "black pad"? would that be a correct statement? What causes this blackening that looks like oxidation under the mic
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Tue Feb 28 12:20:31 EST 2006 | gregp
As far as I recall the Component Express is a copy of a prototype we showed around trade shows about 5 or 6 years ago. In the case of the Component Exress feeder basically you stick an air tube in the back of a stick. It is in no way comparable to
Electronics Forum | Thu Aug 02 14:27:28 EDT 2007 | slthomas
We're having problems figuring out how to optimize our stick feeders. We want to keep them all on the back side but the only way we've been able to get the data generator to finish optimizing without errors is to make all feeders movable, and it send
Electronics Forum | Fri Aug 03 01:44:38 EDT 2007 | pavel_murtishev
Good morning Steve, What does optimizer say? What is the error generated by optimizer? Could you tell me exact error optimizer gives? Topaz ties to fit all feeders mechanically into the feeder plate when optimization starts. Optimizer generates an
Electronics Forum | Mon Aug 06 13:05:19 EDT 2007 | gemengr
Try this... set them on the back and teach their pick up position as stick feeder, change pick up rotation to -90 degree. before you optimize the program, change them to 8mm feeders , them optimize the the program as feeder fix. after the program
Electronics Forum | Mon Aug 13 11:24:57 EDT 2007 | jimmyjames
If you're getting that kind of error it's most likely that your feeder bank hasn't been told that the stick feeders can be placed on the back of the machine, or like they said in earlier posts, the stick feeder size itself may be incorrect in the sof
Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer
I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm
Electronics Forum | Tue Aug 01 11:23:56 EDT 2017 | OrHorti
We are using a custom made nozzle, designed for this particular LED. The dome of the LED is also custom made, the diameter of the lens at the base is 2.9mm while the substrate of the package is 3.3mm, so this gives about 0.2mm spacing between lens a
Electronics Forum | Wed Oct 10 04:49:28 EDT 2018 | netvicher123
This problem frequently becomes an issue with lead free solder paste, because it has very different rheology than leaded pastes. While not a 100% of the time, the squegees are very ofen the cause. When the regular blades are used (steel squegees), th
