Electronics Forum | Wed Oct 07 15:46:36 EDT 2020 | tamasmagyar
Hi Hearse, I currently use a MY600, with a AG Ejector which can place dots between 0.33 and 0.52 mm. The differences for a MY600 with placing small dots is down to ejector and paste. To be able to place dots as small as 0.25 mm, you would need an
Electronics Forum | Wed Mar 21 09:31:39 EST 2001 | CAL
Susan - Thank you for providing more information. It is hard just to give a rule of thumb on warranty time. Comparing other contract manufactures is also misleading. I have seen 30 days to 10 year warranties from contract manufacturers. Here are some
Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef
First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s
Electronics Forum | Wed Aug 11 13:34:58 EDT 1999 | Dave F
(snip) | | You're quite right. However, anyone who uses MeCl in an aerosol spray needs his head examining. I'll go further: if he continues, he will most CERTAINLY need his head, the rest of his CNS and his liver examining a little later on. It has
Electronics Forum | Tue Dec 12 13:33:52 EST 2000 | justin medernach
Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving that agitate the solder, the more dross. Basics first and then the answers will make sense. What is dross? Oxidatio
Electronics Forum | Mon Nov 27 17:50:01 EST 2000 | Dave F
Mike: It gets more humid in the winter? [I can see it�s true (not that I�d doubt you) cause I�m looking a a humidy map of the USA, right now] How does that work outin Californy? [Do the ocean breezes move the humid air in-land in the summer? Er w
Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.
If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Thu Jun 28 10:31:18 EDT 2001 | caldon
Borg Collective?????......7 of 9 is almost worth half my S&*% (Stuff) and becoming a drone. Guaranteed, I ain't dreaming of any Pick and place machines.If it were to happen the machine would be smattered with Hottie female operators willing to load
