Electronics Forum | Mon Oct 13 14:12:10 EDT 2003 | davef
PTH DIP that have been prepped to become SM can be very unreliable, depending on how the part is prepped. Consider asking your customer to do a failure analysis of those solder connections.
Electronics Forum | Mon Nov 17 19:15:24 EST 2003 | Victor
I currently have an inventory of trim caps that have oxidation on the leads. I performed a dip test and am averaging 90% wetting on the leads. On product that has these components already installed is there any risk leaving the parts that have oxid
Electronics Forum | Mon Feb 16 20:47:46 EST 2004 | davef
Removal: Run the board through the reflow oven with the cooling zone turned off. Then pick the QFP with a pair of tweezers. Replace: Don't clean the solder from the QFP. Just dip them in tacky flux, place the component, and reflow.
Electronics Forum | Tue Apr 13 08:38:15 EDT 2004 | Steve L
The temp. was measured at the leads. We also did dipping test on those connectors, it turned out the solderablity of the pins was awful. We're now checking it with the supplier. Thank you all for the input.
Electronics Forum | Wed Apr 28 12:32:07 EDT 2004 | mrmaint
Paul, We are applying the paste flux to the bga. We have a plate that has a 4mil step that we squeege flat and then dip the BGA into the flux.The BGA's that we are using are new components.
Electronics Forum | Wed Apr 28 13:37:21 EDT 2004 | mrmaint
Paul, We are applying the paste flux to the bga. We have a plate that has a 4mil step that we squeege flat and then dip the BGA into the flux.The BGA's that we are using are new components.
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef
Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.
Electronics Forum | Thu Sep 30 14:00:47 EDT 2004 | blnorman
I'll third the motion for hand dipping the boards. One other idea is to get coating in a can. Many companies will supply coatings in aerosol cans for touch up and small usage.
Electronics Forum | Fri Oct 15 10:23:48 EDT 2004 | mrmaint
Matt, are there any discoloration of the pads on the raw boards. i have seen what we refer to as gray pads. Ran into this in the past and it turned out to be a problem at the board house with one of their dipping tanks. The proper levels for the proc
