Electronics Forum | Thu Jul 06 02:36:31 EDT 2006 | visitor
I have question,is this the only Ag/Pd component in your board? If yes then concentrate on this component, I would suggest evaluating other component of the same value with Tin terminations. If I am not mistaken Ag/Pd plated components termination
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Sat Nov 10 23:46:36 EST 2007 | mika
BTW, The surrounded QFN fine pitch terminals should have the normal aperture reduction of 7 % in case of RoHS Senju solder paste. This works for our Telecom customer. The vias in the ground pad will be somewhat filled with solder and makes it diffi
Electronics Forum | Mon Nov 26 20:11:41 EST 2007 | shy
Yes, i'm agree with you davef but i'm not put the chipbonders onto pads. i'm put the chipbonders at the beneath component (center between both component terminals) which the idea is to hold the component during wave soldering which might cause the co
Electronics Forum | Fri Nov 30 16:41:18 EST 2007 | stevek
Does anyone have any experience with the Amkor Fusion Quad package? I'm wondering about the coverage of the heatsink slug and it floating the interior leadless terminations apart. Any designers have any experience escape routing the underpart/inter
Electronics Forum | Sat Jun 21 11:00:32 EDT 2008 | 1036
We recently bought an used MPM SPM screen printer. The system can not boot up correctly and terminates the program finally. During the computer booting up, I can see error massages "mouse could not be found", "abnormal program terminated", "trap 0".
Electronics Forum | Tue Oct 07 15:08:47 EDT 2008 | dphilbrick
I have a job that requires a minimum of 3% lead in all component terminations. Anyone doing DOD out there with the same? How do you get around this with R's and C's especially? I believe we would be OK if the terminations were not pure tin as well bu
Electronics Forum | Fri Apr 08 00:28:34 EDT 2011 | Jacki
We use 7mil stencil to print Epxoy by using printing machine. Not all Tant from the same reel fell down. Some Ok but some misaligh. So, we concluded that Tants with higher terminal fell down while the Tants with lower terminal were fine. I dun say
Electronics Forum | Wed Oct 03 09:23:21 EDT 2012 | kkay
Well what we have seen so far is that the voiding occurs on nearly every part, but only underneath the terminations. When we run a board with no parts we do not see any voiding as there are no terminations to trap the out-gassing from the pads. Next
Electronics Forum | Fri Feb 15 06:59:07 EST 2013 | davef
Use a standard that everyone will recognize. If you say, "The solderability test was performed in accordance with ANSI/J-STD-002 'Solderabiility Tests for Component Leads, Terminations, Lugs, Terminals and Wires'” [ipc.org/TOC/J-STD-002C.pdf ], every
