Electronics Forum: since (Page 144 of 276)

Re: No-clean conductivity in analog circuits

Electronics Forum | Wed Dec 08 14:44:13 EST 1999 | John Thorup

Hi Chuck We make precision analog and hybrib audio processing equipment for the radio and TV broadcast industry. We have not experienced any problems relating to no-clean reflow since the introduction of the process several years ago. It is known t

Re: In House or Out

Electronics Forum | Thu Dec 02 11:42:03 EST 1999 | John S.

Dick, My company made the transition from thru-hole to SMT about a year ago. We've been building thru-hole boards successfully for years, but our customer requirements have forced us into the transition. Wolfgang made a very good comment. Start s

Re: SMT Zero-defect Soldering

Electronics Forum | Thu Dec 02 11:28:03 EST 1999 | Mark D. Milward

Dave F. Thanks for the info. I've spoken with Ralph and Les Hymes in the past and have taken Manko seminars before. I read something not long ago that Dr. Juran had written on the subject of Zero-defect soldering programs and was hoping for response

Re: Siemens ( Siplace ) BGA inspection

Electronics Forum | Fri Nov 19 14:50:46 EST 1999 | nick mata

If you are seeing reflection on the underside of the part, I would first begin with the recommended light levels for the BGA. You should be able to obtain the levels from the Siemens help desk. There is a 2 to 3 page document with levels for a variet

MSH Placement trouble

Electronics Forum | Fri Nov 19 07:45:59 EST 1999 | Claude Couture

Our Panasert MSH is randomly mixing up the parts placement. About 1 in 10,000 placement will be a wrong part. The wrong part may be any other part present on the feeder carriage. A chip resistor 0805 may be replaced by a minimelf or a sot-23. It is

Re: Calculate SMD movement during reflow?

Electronics Forum | Wed Nov 03 10:30:27 EST 1999 | John Thorup

Hi Anthony I'm not sure I understand your question. Do you mean move to a better or more precise placement or to an error or bad position? I'm not aware of any calculation that can predict movement since it is based on so many factors like component

Re: Polarity of parts in packages

Electronics Forum | Fri Oct 29 18:24:46 EDT 1999 | B.Smith

JC, We 'had' this problem previously, but eliminated it for good by using the following: (1) Create a procedure for part orientation that follows IPC standards. Give a copy of this procedure to your receiving department, your buyers, as well as all

Re: solder mask wrinkles

Electronics Forum | Tue Oct 19 16:59:58 EDT 1999 | Carol Zhang

Hi, thank you for the idea. I may try solder iron, but it much more slower since I have to solder spacers one by one. a stimpson press is used to press the spacer on the board and the edges of the spacers are rolled. Then we solder the edges to

Tombstoning

Electronics Forum | Tue Oct 12 15:20:44 EDT 1999 | Jim Schultz

I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).

Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Fri Oct 08 14:01:27 EDT 1999 | C.K.

We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 70


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