Electronics Forum | Wed Apr 14 17:14:49 EDT 1999 | Stephen Oltmann
Check with BTU. They have dryers in the length you need. Good luck! | | I need to cure conformal coat on a 19" x 15" board. The material needs 7 - 10 minutes at 100deg C, but I have limited floorspace so I'm looking for an oven with about 36 inches
Electronics Forum | Sat Mar 20 00:58:10 EST 1999 | Mike C
| After rmoving a BGA (plastic)to correct unexplained shorts | I installed another BGA using flux only. | Checking on an X Ray machine and found two shorts. | | can anyone give a good explenation ? | | Thanks | | Ron | Another possibility Via's n
Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon
| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc
Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Electronics Forum | Mon Jan 25 13:56:45 EST 1999 | Parvez Patel
Chang Hong while developing our CSP rework process, we found a temperature spread of about 130C at a distance of approx 150 mils from the component edge. our nozzle had about 20 mils clearance from all sides of the component being reworked. depending
Electronics Forum | Tue Jan 05 13:03:28 EST 1999 | Michael Allen
Another concern is that some bulk feeders present resistors upside-down 50% of the time; I'm told that this can affect heat dissipation and cause other problems (e.g., hidden partmark). Note: this is not a problem with chip capacitors because they'r
Electronics Forum | Wed Sep 30 20:56:31 EDT 1998 | Tony Barry
Assuming that your components and PCB's have good solerderabillty and are stored in an air conditioned environment and kept free of contaminants then your problem sounds as though there is insufficient wetting of the component leads due to low temper
Electronics Forum | Fri Sep 18 10:53:37 EDT 1998 | Jim Wilde
I am looking for a small benchtop rework station for replacing bad QFP132's as well as a variety of SO8 to SO20 components and 1206 chips. I've been looking into some IR heating equipment as well as hot air tools, but have little experience with suc
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson
I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B
