Electronics Forum | Wed Oct 01 21:22:37 EDT 2003 | ramanandkini
We have a 1.6 mm thick automotive PCB board of size 35x70mm. One of our vendor has given us a batch with lesser soldermask thickness 5~8 microns. Will this affect the circuit board on a long term. What should be standard for the soldermask thickness?
Electronics Forum | Thu Oct 09 15:57:00 EDT 2003 | davef
Start your recipe development with the recommendations of your paste supplier. The recipe in your new oven should produce identical results to your old oven [assuming you're using the same paste]. Given that your new oven is shorter than your old
Electronics Forum | Mon Oct 06 16:18:30 EDT 2003 | pjc
If the flux is already eating thru Cu it must have been some time since the boards were soldered with the OA flux. Ionic contamination testing (with OmegaMeter or IonoGraph)can be done to find contaminated boards and cleaning the boards can be done
Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef
J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin
Electronics Forum | Mon Oct 13 11:01:25 EDT 2003 | markhoch
Our customer is starting to see some solder joint failures during their extensive testing proceedures. Specifically with an SMD/DIP device that has a very small foot in relationship with the pad on the PCB. (By SMD/DIP device I mean a DIP IC that has
Electronics Forum | Tue Oct 14 23:30:38 EDT 2003 | Dean
Get high magnifiction micro structure analysis of the failed joints. I bet you will see the correct grain structure. What about the other part types? Any failures? I assume this is standard 63/37 Eutectic solder? These aren't heart monitors or
Electronics Forum | Mon Oct 13 16:39:19 EDT 2003 | lgroves
Hi Andrea, Another good place to start in addition to the oven manufacturer is your solder paste vendor. They can help you select the correct paste and give you the right reflow profile to use for that paste. Keep in mind that most vendors (paste, s
Electronics Forum | Thu Oct 16 00:08:31 EDT 2003 | Dean
Why would you have troubles if and when you switch? Isn't that the point of materials evaluation? Understanding the impact and material capability BEFORE "betting the farm on it". I would never stake my career on a solder paste without an Engineer
Electronics Forum | Wed Oct 15 18:18:09 EDT 2003 | russ
Gabe, Interesting, I have never encountered that before. Why would you think we have never seen it? I would think that the increase in wetting would help "pull" the solder onto the leads reducing bridging. Am I wrong? Russ (not a rocket scientis
Electronics Forum | Tue Nov 04 16:32:22 EST 2003 | Marc
Marc, I agree with Dennis. Your best method is to apply solder mask over the pads, then install the BGA. You can also remove the balls or completely remove the pads, but it take a skill person to do it. We do all that type precise rework in Southern
