Electronics Forum: standards (Page 150 of 360)

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 09:12:59 EDT 2006 | pavel_murtishev

Good afternoon, Profile is standard ramp-soak-spike (According to paste manufacturer requirements), paste is Almit V16L HM1-RMA, type 3, Sn62Ag2. Look here for details: http://www.yousendit.com/transfer.php?action=download&ufid=98684D1201B0F001

treiber washer question

Electronics Forum | Tue Aug 01 15:02:06 EDT 2006 | BillB

Had a Treiber in a past live. Had a standard air knife in the first section and then a turbine blower with a stainless steel air knife with about 15-horse motor. Had some problems with bearing on the turbine Make sure the exhaust hot air doesn't con

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 08:18:24 EDT 2006 | John N.

Hi all, I work for a service company who do SMT repairs for a Blue Chip. The JEDEC standard doesn't seem to mention how long (if at all) you should bake a planar after placing a new BGA (after field failure). Any ideas? Thanks in advance. regards Joh

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *

O-Ring

Electronics Forum | Wed Aug 23 11:06:33 EDT 2006 | cyber_wolf

Chunks, I figured you would know about O rings. :/ Try these... http://www.callapg.com/orings.aspx?id=standard&sitrackingid=530036&kc=E1HvV4hZ7kYxr863lQqmwGDECdagjxzxvO8ZvgjH Mcmaster Carr also sells O ring splicing kits.

MPM UP2000 Hi-e

Electronics Forum | Thu Sep 07 15:53:09 EDT 2006 | Buzzword Master

I like Buzzwords. My favorite 5 buzzwords: 1. Business-centric 2. Synergy (One of my favorites) 3. Value-added 4. Win-win situation 5. Spatial Standardization I'm also particularly fond of people who make "quote" marks in the air with their fingers

Paint flaking from Lead Free solder pot

Electronics Forum | Fri Sep 08 11:50:39 EDT 2006 | Rob

SN100C is designed not to corrode your pot, and can be used on standard solderpots (after a proper clean out), whereas SACX is still corrosive and if the coating is compromised then could cause problems. Get it in writing from the supplier that the

Industry Standard Acceptable SMT Component loss?

Electronics Forum | Wed Sep 13 12:42:48 EDT 2006 | russ

much prefer using percentage instead of fixed overage. Example.... A run needs 100,000 parts, (1% shrink is 1000 parts!) you want to only issue 60 over? I recommend 2% for popcorn and exact for retrievable/ identifiable parts like sticks and trays

Industry Standard Acceptable SMT Component loss?

Electronics Forum | Fri Sep 15 10:20:26 EDT 2006 | russ

Yes indeed you make great point as well, we also run low volume production as well as some high running stuff, seems as though some type of combo nwould be best, maybe something like 20 pieces over or 2% wichever is greater maybe? Russ

Industry Standard Acceptable SMT Component loss?

Electronics Forum | Mon Sep 18 10:40:15 EDT 2006 | SWAG

Depending on what kinds of machines you run and feeder style, self adhering leaders work well to minimize the need for a long leader. We use them on every reel. We can generally load most feeders with only waste of about 4 parts by use of leaders (


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