Electronics Forum | Thu Apr 17 07:57:07 EDT 2008 | GSx
Those components can be soldered at both SnPb and Pb Free Reflow process. In case you will submit them to Pb Free Reflow temperature you must treat those components as MSL-3 In case you will submit them to SnPb Reflow temperature, you must treat t
Electronics Forum | Fri Apr 25 04:44:56 EDT 2008 | jkhiew
Hi all, I mean after post adhesive oven curing (SMD at bottom side) prior to manual insert of PTH components (top side), what is the recommended storage time prior to wave soldering in order to avoid pin/blow holes and sunken joints issues (pcb asse
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Wed Apr 30 07:48:37 EDT 2008 | realchunks
If your pots are open you then just need to dry them. Don't hide them. Are they rated for water clean? If not hand solder after cleaning with no-clean wire. Hand cleaning with IPA is dangerous - you really just push the flux around and don't was
Electronics Forum | Fri May 02 08:50:08 EDT 2008 | realchunks
You're not the only one. We just got done with a batch of ICs that had a high reject rate at placement. The machine was rejecting about 70% of the parts because it didn't recognize the part. The reason it didn't recognize the part was due to the f
Electronics Forum | Thu May 01 14:25:31 EDT 2008 | ck_the_flip
Most white papers, like this one http://members.ipc.org/ipclogin/ipcmembers/IPC/Route/0706/0706techpaper.pdf, have written that lead contamination in a lead-free solder joint leads to all sorts of reliability problems. Consensus is that, if the cont
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
Electronics Forum | Thu May 01 09:09:31 EDT 2008 | scottp
I looked at some no flow underfills about 5 years ago and they weren't quite ready for prime time yet. It's time to give it another look and I'm wondering if anyone is using them in production and how it's working. I'm looking at them for reducing
Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
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