Electronics Forum: solder (Page 157 of 2099)

Mixing no-clean solder with activated

Electronics Forum | Tue Jun 26 10:49:59 EDT 2001 | genny

Yes I have read that standard, but it doesn't tell me what I need to know. Both have the same activity level and halide rating (L0) The AIM technical guy told me RO is a natural gum rosin, while (RE) Resin has more processing or something (maybe so

Mixing no-clean solder with activated

Electronics Forum | Tue Jul 03 15:45:04 EDT 2001 | genny

No, I haven't even gotten around to formulating my test plan (what PCB to use, what lab to use, etc, etc,...ad nauseum), let alone convince my company that we need to do it. I also got caught up in another extremely tight deadline project and haven

Re: Control the solder paste

Electronics Forum | Tue Jan 11 05:46:09 EST 2000 | Wolfgang Busko

Hi Dave, that was kind of a more rhetorical question. Normally paste is used before shelflife expires and delivery time is short enough to get in no trouble. The normal situation is that you try to get your equipment running means constant use of pas

Re: vibration during solder reflow

Electronics Forum | Tue May 25 09:19:00 EDT 1999 | Ricardo Lopes

| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work

Labeling of SMT solder stencils

Electronics Forum | Tue Sep 14 08:46:31 EDT 2004 | scombs

I'm currently working for a OEM that has 700+ stencils in house and we received 30 to 40 stencil a month. We recently switched to a no clean process which is causing the stencil part numbers to disappear from the stencil frames due to the saponifier

RoHS parts - leaded solder

Electronics Forum | Tue Oct 25 16:27:46 EDT 2005 | stepheniii

It is not OK to use leadfree BGA's with a lead process. Other parts "should" be reverse compatable. But I first saw problems over 5 years ago with Paladium leads and a lead process. Don't confuse saying "it's ok to use lead free parts in a leaded p

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 15:10:48 EST 2006 | ms

Hi Steve Thanks for your reply. Your comments make it sound like it may be the nature of this paste. Any one else agree? Paste control is fairly good. Paste is put in fridge straight after it arrives at inwards goods, (4deg). Removed from fridge

Best scope to solder under....

Electronics Forum | Thu Mar 22 13:57:47 EDT 2007 | chris

I would recommend checking out the stereo microscopes from Vision Engineering (www.visioneng.com). We have used the older and newer style Mantis scopes and our assemblers love them as you can do rework in a very natural and comfortable seating posit

Vertical bend resistors solder fillet

Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero

Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim

stencil/printing machines for solder paste

Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam

Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V


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