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BGA Assembly

Electronics Forum | Wed May 29 13:16:33 EDT 2002 | jax

The only reason I can see for doing this is: Apply more paste than a one-to-one round can provide. Square, diamond, etc... does not matter. Normally this is done for PTP applications but,... If it gets the job done, who cares.

BGA Assembly

Electronics Forum | Wed May 29 14:24:51 EDT 2002 | caldon

Stick with round aperatures they work fine. If you are successfully processing fine pitch QFP's then switching to BGA's should be no problem. Profiling is a little tricky, a thermal couple should be mounted at the under/ center of the component. cal

BGA Assembly

Electronics Forum | Wed May 29 19:04:39 EDT 2002 | russ

I have heard of using diamond apertures for BGAs to tell you in XRay inspection if you reflowed (diamond means that paste did not reflow) that is the inly thing I coud think of as to why you qould want to do this. Russ

BGA Assembly

Electronics Forum | Thu May 30 07:13:46 EDT 2002 | matherat

Ben, I am not sure about diamond shaped pads but if you are just getting into BGA you need to know about SIPAD ssd. http://www.sipad.com mkehoe

BGA Assembly

Electronics Forum | Tue Jun 04 05:41:42 EDT 2002 | ianchan

Yo, Hussman69, you are one scary dude... in fact you remind me of that catbert... as an add-on, "metcal" has a good semi-auto BGA rework system and their engineering support is strong. then again, our engineers shd be optimizing the production lin

BGA Assembly

Electronics Forum | Fri Jun 07 15:16:25 EDT 2002 | gdstanton

Ben, Get a copy of IPC 7525 and review it. This will help you understand the relationship of aperture geometry to paste transfer. Good Luck, Greg

BGA Assembly

Electronics Forum | Mon Jun 24 17:13:27 EDT 2002 | garyfosburg

We, too, are getting into BGA manufacturing. In order to start experimenting, we're looking for a place to buy test boards with Gerber so that we can experiment prior to "going live" with a customers BGA requirements. Does anyone know of a company th

BGA Assembly

Electronics Forum | Tue Jun 25 16:15:20 EDT 2002 | dason_c

Hussman, I know when the oven temp at around 140F and the relative humidity is below 10% and meet the J-STD requirement but I never see any recommendation from the supplier to store @ this temperature. Can U advise where I can get more information?

High-Temperature Solder Paste/wire: Sn05Pb93Ag02B

Electronics Forum | Wed May 29 22:22:28 EDT 2002 | davef

I don't think thay offer that specific alloy, but if you check with Kester, Alpha, and Indium; they might be able to suggest a supplier or an alternate product thaat is quite similar.

Epoxy Push Test Specifications

Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell

Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell


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