Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor
I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi
Electronics Forum | Wed Jan 28 21:47:56 EST 2009 | padawanlinuxero
Hello! I am having trouble with the new changes from lead joint to lead free joint, we are working on change to lead free, I am using a 3 zone oven reflow, the zone temps are : zone 1 zone 2 zone 3 (top and bottom) 128 208 260 th
Electronics Forum | Fri Jan 30 06:28:42 EST 2009 | gregoryyork
Hi Armando Hotflow 7 is a big machine and one of the best Reflow ovens around (in my opinion), well suited for Lead Free. A typical 1.6mm board has the following settings for Lead Free SAC305 paste All Temperature settings are Top and Bottom Prehea
Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered
We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs
Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef
Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner
Electronics Forum | Mon Apr 13 14:36:18 EDT 2009 | leemeyer
I have seen this problem before. There is a cable that runs from the Quadalign board to the backside of the backplane. It is not secured in any way so it may have come loose in shipping. Open the right side panel on the machine. The Quadalign board
Electronics Forum | Fri Apr 17 10:44:29 EDT 2009 | rmitchell
Hi, follow up, Thanks to everyone that responded. We finished the build, the sun burst thru the clouds and the birds sang. Well that was a slight exageration. Sorry for lack of detail on the original post, I was frazzled. Since the 0201's were p
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Tue May 26 11:13:49 EDT 2009 | xinxi
Is the components on the top or on the bottom of the pcb? Have you checked whether the temperature on pcb are too high when it pass through SW that it exceeds the limit that the components can take? Do check with the component manufacture for the te
Electronics Forum | Thu Aug 20 15:10:21 EDT 2009 | davef
Responding to your points: * The intermettalic layers [ie, Cu6Sn5, Cu3Sn] between the solder and the copper pad is the same composition with both lead free and leaded solder. The lead in solder has no impact on the intermetallic. * As you say, increa
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