Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric
| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing
Electronics Forum | Tue Mar 16 14:05:04 EST 1999 | Steve Skinner
| Does anyone have any recommendations on spray fluxers? Are there major differences between the high priced ultrasonic machines to the low priced flux/air spraying machines? We are going to be spraying an OA flux with 11% solids content. Are there a
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Wed Feb 03 22:47:48 EST 1999 | Chris G.
| Hi! | | Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. | | Teemu M�kiniemi | Teemu, For some time now, as I am sure you are aware, the PCB industry has been tryi
Electronics Forum | Fri Jan 22 14:24:44 EST 1999 | Dave F
| I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week. | Michael: Let's take a different angle on this. Why not ha
Electronics Forum | Fri Jan 22 17:38:07 EST 1999 | Michael Larsen
| | I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week. | | | Michael: Let's take a different angle on this. Why
Electronics Forum | Mon Jan 11 15:20:29 EST 1999 | Chrys
| I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Mon Nov 30 16:48:48 EST 1998 | Brian McCarthy
| Can anyone tell me why Philips would obsolete my feeders. I am trying to add a newer machine to my line and I am told that the feeders from my 84VZ no longer work. Is this true? | Not exactly. Mechanical feeders for the CSM-66/84/VZ are not usa
Electronics Forum | Fri Oct 23 09:44:43 EDT 1998 | Chrys
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
