Electronics Forum: tinning (Page 163 of 169)

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper

| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua

Brush-Up Your Intermetalics!!!

Electronics Forum | Thu Jun 17 21:31:06 EDT 1999 | Dave F

| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w

Dream Machine

Electronics Forum | Mon Jun 25 20:47:09 EDT 2001 | davef

Much of the focus of pick & place machine supplier development efforts seems to directed towards either: * Head location detection, adjustment, and control. OR * Component location prior to pick-up. OR * Component position error correction after pick

Re: Solder surface tension

Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix

| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl

Re: Solder surface tension

Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup

| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s

Re: Solder surface tension

Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian

| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Thu Sep 23 23:58:01 EDT 1999 | Earl Moon

| | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-b

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Mon Sep 27 12:19:19 EDT 1999 | John

| | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near

Re: Pb Free Products

Electronics Forum | Wed Sep 22 22:18:37 EDT 1999 | Dave F

| I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb)

Re: little green men

Electronics Forum | Sat Jul 17 13:25:02 EDT 1999 | Scott

| | | | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | | | | | What is it you're tr


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