Electronics Forum | Fri Nov 23 12:10:15 EST 2001 | Warren Pumyea AMT, Inc.
I'm looking for a software package to assist in the quotation of assembled PCB's. Does anyone know of a package on the market today. I suppose a template to MS of some other software MFG. would also work. Thanks.
Electronics Forum | Tue Dec 18 16:49:17 EST 2001 | davef
J-STD-001 - Requirements For Soldered Electrical & Electronis Assemblies is the governing document. It defines no specific limits like you mention. It states words to the effect that preheating should not do bad things.
Electronics Forum | Thu Dec 20 21:26:32 EST 2001 | Lex WW
My company is just beginning to move towards the assembly of optical modules on PCBAs. Are there any basic tutorials out there that can give some understanding on this huge subject? Thanks!
Electronics Forum | Thu Jan 03 07:49:20 EST 2002 | hany_khoga
Thanks Scott: The Assembley is Mixid ( reflow then wavesoldered). It is One curcuit. Is the Tg averagely known for FR4 PCB assemblies? Hany
Electronics Forum | Sun Feb 17 12:06:40 EST 2002 | tech127
I am looking for thosewho are, or have been, users of Automated Production Systems assembly equipment. I would like to know what your experience has been with this brand of equipment.
Electronics Forum | Mon Feb 25 21:14:25 EST 2002 | davef
This sounds like information bantied-about by the fine folk at CSL [Contamination Studies Laboratories in Kokomo, IN]. If so, this includes the sum of the halides from the following sources: * Fabricated board * Components * Processing of the assemb
Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe
We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening
Electronics Forum | Wed Mar 06 21:20:36 EST 2002 | davef
We are aware that 0.4mm parts are coming [ http://www.kns.com/prodserv/flipchip/products/roadmap-ultracsp.PDF ], but are assembling none at the present time. We�re in no rush!!!
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
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