Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
Electronics Forum | Fri Jul 28 21:07:13 EDT 2000 | Wilson
Dear all, Thanks for your comment! Dave, your suggestion is very useful. I can find several good machines at there. Thanks! John, your curiosity is quite normal, as I also have no idea of the board. It is a new model. We haven't got the boards yet,
Electronics Forum | Tue Jul 25 20:46:01 EDT 2000 | Dave F
Vicki: The other responders make good points. Taking a slightly different, slightly more aggressive tact, you might try something like this: * Click on ... http://www.ssafl.com/bat_prod.htm ... and buy a unit of the proper size to fit your stature
Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C
Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to
Electronics Forum | Fri Jul 07 16:04:42 EDT 2000 | DONALD
We have an Ersa selective soldering machine here. We use the wire solder with the automatic feed. We dross and clean the pot roughly once a week. You can tell when it needs it by looking at the solder fountain. We do the nozzle at the same time. We c
Electronics Forum | Fri May 26 14:03:52 EDT 2000 | GP
I have a problem on fine pitch SMT connector reflow. The board size is 18" x 12" with 8 layers FR4 material and emersion gold finishing. All the other components include 0603 on the board are reflow very well, except 20 mil pitch SMT connectors. The
Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh
I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s
