Electronics Forum | Fri Aug 13 07:11:12 EDT 1999 | Earl Moon
Ladies and Gentlemen, As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous insigh
Electronics Forum | Fri Aug 13 00:08:16 EDT 1999 | FMung
| | | Hello, | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | B.Regards, | | | Felix | | | | | I have a process cause and eff
Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup
| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem
Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton
| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa
Electronics Forum | Fri Jul 30 16:43:28 EDT 1999 | Dreamsniper
Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce solder
Electronics Forum | Wed Jul 28 20:28:26 EDT 1999 | Carlos Palacios
Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into n
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Wed Jul 28 20:31:42 EDT 1999 | Dave F
| We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | I understand 63/37 to be pretty
Electronics Forum | Mon Jul 26 18:28:10 EDT 1999 | Jon Prokop
Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of pr
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
