Electronics Forum | Thu Sep 05 18:15:15 EDT 2002 | pjc
There are chemistries out there that will solublize some post-solder NC flux residues. I have had success with Zestron material Vigon A200 and Petroferm material Hydrex DX. Go to http://www.zestron.com and http://www.petroferm.com These are chemical
Electronics Forum | Tue Sep 17 15:03:31 EDT 2002 | davef
Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint. Or try: * �Assembly And Interconnect Reliability Of BGA Assembled
Electronics Forum | Thu Oct 10 21:41:38 EDT 2002 | surachai
No need to change solder pot ,anyway the contamination during clean and no clean flux may happen when change from clean to no clean which it will float on the surface of solder pot , you only clean it ( same as the dross removal ) due to in the norm
Electronics Forum | Mon Oct 21 11:49:20 EDT 2002 | sueph
Mike, We are currently wave soldering several assemblies with with a lot of ground plane. The soldering handbook we have in house suggests a preheat temp for metal core multilayer boards of 230 to 270 degrees F' (110 to 130 C'). It was scary at fir
Electronics Forum | Tue Oct 29 15:55:16 EST 2002 | babe
If you are using a low end hot air system IE: Weller, Hakko or Pace then your problems are with the system and not necessarily with your process. However process is important. We have found by inspection with an Ersa Scope (BGA inspection system) tha
Electronics Forum | Thu Oct 31 11:08:12 EST 2002 | soupatech
Being very new to SMT I won't assume I know what the problem is but.... I had lots of air pockets in solder joints, 95% of the boards. Everyone I spoke to thought it was a problem with my process but when one board was sent to our supplier they admi
Electronics Forum | Mon Nov 25 20:38:39 EST 2002 | davef
That's basically it. In a wonderful world, the oxides flow on top of the flux during heating through reflow. Obviously when compared to reflow soldering, you create much more dross with your wave by: * Pumping a large volume of very hot solder to h
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Fri Dec 06 10:16:57 EST 2002 | davef
Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acceptable" cleanliness varies between specification and from company to company.
Electronics Forum | Thu Dec 19 12:08:01 EST 2002 | davef
Facts!!! I got facts. Mechanical strength experiments of Sn43/Pb43/Bi14: �Microstructural And Mechanical Characterization Of 43/43/14 Tin/Lead/Bismuth�; J. Marshall, J. Calderon, J. Sees; Soldering And Surface Mount Technology; 10/91, p25-27 Look
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