Electronics Forum | Fri Sep 11 06:35:19 EDT 1998 | KME
How can solve the small solder ball after w/s. (oxygen level is 40000~5000ppm, no-clean flux & Tamura N2 w/s machine).
Electronics Forum | Tue Sep 15 10:34:27 EDT 1998 | Larry
| How can solve the small solder ball after w/s. (oxygen level is 40000~5000ppm, no-clean flux & Tamura N2 w/s machine). Post your question in the SMT Forum for a better response. This area is not for tech questions.
Electronics Forum | Wed Aug 19 19:16:43 EDT 1998 | Steve
How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these?
Electronics Forum | Fri Aug 21 15:03:42 EDT 1998 | Dave F
| How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these? Steve: People on TechNet have spent alot of time talking about BGA pad design. Use the link below. Dave
Electronics Forum | Fri Jul 24 01:28:00 EDT 1998 | Alex Ondi
I also heard of a company considering a patent on aperture design. The aperture was a "chevron" aperture, very similar to the "V" shaped aperture recently touted in SMT magazine, presumably for the purpose of reducing solder balls. Go figure!
Electronics Forum | Tue Aug 07 20:53:14 EDT 2001 | davef
slowing-down the conveyor to allow the solder to heat these balls more. But that may not be the answer, because if the flux is exhausted, more heat will not help. Then if the flux is exhausted, the answer is to crank the belt. Two different answer
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Wed Oct 17 19:12:32 EDT 2001 | scott
Dave's right! Wash the boards RIGHT AFTER reflow, don't let that residue harden. Then you turn around and cure that stuff during the second reflow by not performing the first wash???? wow.... By the way, are you having any problems with white resi
Electronics Forum | Mon Dec 03 21:48:40 EST 2001 | davef
How do yall monitor the concentration of yer saponifier? [NOTE: This is a BIG chance for NC flux-types to make smart remarks in retribution for remarks made about removing solder balls in an aqueous cleaner.]
Electronics Forum | Mon Apr 22 18:45:07 EDT 2002 | Steve Townsend
Chances are your profile is fine. There is probably too much paste on the descrete pads. Consider reducing the aperture size of the stencil. Good luck.
