Electronics Forum | Tue Jun 17 10:57:35 EDT 2003 | swagner
We had a product a couple of years ago that did the very same thing, we increased the amount of webbing to reduce the amount of warping.
Electronics Forum | Tue Jun 17 12:47:53 EDT 2003 | JB
After you depanelize your product, use the remaning "frame". Just set your panels on the "frame" before reflow. That will give some extra support. JB
Electronics Forum | Tue Jun 17 20:03:44 EDT 2003 | samaniegocesar
Hello Jipp. Before I recomend something, can you send to me a picture of the PCB (Bare board) and one picture with the PCB with components, I could help you. samaniegocesar@smtnet.com, samaniegocesar@hotmail.com Regards...
Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza
Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe
Electronics Forum | Thu Jun 19 15:32:06 EDT 2003 | pjc
Recommend you consult device mfg.'s data sheet or their customer support line to confirm from engineering. I think you mean't 30 C, not 300 C, because the device will likely be toast at 300 C.
Electronics Forum | Tue Jun 24 07:16:08 EDT 2003 | sanjeevc
The moisture sensetive bags that carry your BGAs will have the specs in regards to your baking cycles.But definetly you have to bake the BGAs if its been stored at 60% humidity.Normally the shop floor area should not be at such higher humidity.You ca
Electronics Forum | Thu Jun 19 10:16:01 EDT 2003 | caldon
I went to http://www.spie.org web site. the booksite link here you may find some good books. SPIE is a great resource. Cal Communications Test Design, Inc. www.ctdi.com
Electronics Forum | Thu Jun 19 08:15:28 EDT 2003 | rmurtuza
Which is the best surface finish to be used on non- solder mask defined pads in terms of cost and reliability? What are the advantages and disadvantages of the various surface finishes such as Ni/Au , Cu OSP , Ni /Pd and HASL.
Electronics Forum | Fri Jun 20 10:27:19 EDT 2003 | Cristiano Dick Smiderle
Hi We are experiencing serious problem with ceramic capacitors. They are with low electrical resistence and the problem is intermittent. We found some of them with micro cracks but not all. What could be the causes for this problem? We are su
Electronics Forum | Fri Jun 20 11:05:53 EDT 2003 | russ
Why don't you give us the full process along with your delta T for the wave (final preheat temp to wave contact temp). Don't forget de-paneling, ICT, and other things. It could be from the supplier, but it usually is from excessive placement force
