Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Wed May 11 09:07:46 EDT 2016 | SN
We are facing SMT components No solder and solder bridging issue (Glue PCBA) at wave soldering process. Fine tuned the wave parameters improved but not able to eliminate the issue. Suspecting because of moisture pad and component leads contaminated d
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Wed Jun 14 12:49:12 EDT 2023 | spoiltforchoice
#talkingwithrobots
Electronics Forum | Thu Jun 15 00:43:58 EDT 2023 | frankchan
Hahaha, that's straight to the point
Electronics Forum | Fri Sep 09 06:10:03 EDT 2016 | jswatt
the time between SMT & wave should be as short as possible but at a max it is controlled by strictest MSD part, so if you have a part with only a 48hr MSL window then it needs to be with the 48hrs. Can you post images of what you are getting? It may
Electronics Forum | Wed Jun 14 11:26:03 EDT 2023 | stephendo
Use a PCB manufacturer that is at least 30 years old.
Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef
Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?
Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram
We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.
