Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Wed Jul 11 20:17:05 EDT 2001 | davef
I�ve written a review to be published in an up-coming SMTnet Newsletter of �Printed Circuit Assembly Design� Leonard Marks, James A. Caterina [Hardcover - 368 pages (July 26, 2000) McGraw Hill Text; ISBN: 0070411077]. In short, � In �Printed Circui
Electronics Forum | Sat Jul 14 10:34:42 EDT 2001 | davef
This portion of SMTnet is intended for people whining about the operation of the forums and what-not. A lot of the people asking questions like your use the production forum. We don't have an air knife on our wave, but I recall some threads on SMTn
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Thu Jul 26 13:17:45 EDT 2001 | Hussman
Most solder paste manufacturers will take a reasonable amount of paste back, just so they won't loose your business due to bad paste. But if you're asking to ask to ask - separated paste from flux is not a bad thing if the jar was never opened. Pas
Electronics Forum | Mon Jul 23 20:18:18 EDT 2001 | davef
Prasad�s book, that an earlier poster mentioned, is good, but other books to consider are: * MacLeod Ross �Guide Design & Manufacturing V1 & V2� Electrochemical Publications * Wassink & Verguld �Manufacturing Techniques For Surface Mount Assembly� El
Electronics Forum | Wed Jul 25 23:35:18 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
Electronics Forum | Wed Jul 25 23:37:11 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
Electronics Forum | Mon Jul 30 11:10:41 EDT 2001 | hinerman
There are several things to look for in a compliant tooling system 1. How much force per pin is required to lock the pins in place? This is especially important since you will be multiplying by the total number of pins on all modules. 2. Is ther
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